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Product equipment  Laser cutting equipment Laser cutting equipment Laser drilling equipment Laser marking, etching equipment |
Product advantages
Double platform laser cutting equipment
Principle of laser cutting
Overall solution of ultra-fast laser cutting equipment for brittle materials such as optical glass, quartz, sapphire and ceramics.Double platform, cutting one, can process large format workpiece, efficient and flexible, suitable for various production, experimental scenes.
The laser generates ultra-short pulses with extremely high energy and interacts with the workpiece in a very short time. When the beam propagates and acts in the material, it breaks the stress structure to form micrometer-level wire holes. By optimizing the hole spacing, micro-cracks are formed and cutting is achieved with the fragment process.
Advantages of laser cutting
>The overall automation level of the equipment is high (cutting and splitting can be integrated), with low power consumption and simple operation
>Because of the particularity of non-contact processing, laser technology can complete the process that cannot be realized by traditional methods
>without consumable processing, low operating costs and more environmental protection
>High precision, no taper, no secondary damage to the workpiece